Deposition

1. LPCVD Oxidation Three Stack Furnace (KoyoLab)
2. DWL 66 Laser Write (Heidelberg DWL)
3. Plasma Enhanced Chemical Vapour Deposition (PECVD)
4. E-Beam Evaporator (Edwards Auto 306 Turbo)
5. Metal evaporator (Med 010 Balzers)
6. Sputter Coater (Baltec SCD-005)
7. Oxidation Furnace
8. DC/RF Sputtering System (NTI Nanofilm)

Etching

1. ICP PlasmaLab System 100 (Deep RIE)
2. Electrochemical Etch System (MEMS Potentiostat SC)
3. Plasma Enhanced Chemical Vapour Deposition (RIE)

Lithography

1. Karl-Suss MJB Mask Aligner (Karl Suss)
2. Ceramic Hotplate (Fischer Scientific)
3. Coating Dispensing System – resist spinner (Spin Coater P6700)
4. Resist Spin Coater (Mikasa SpinCoater 1H-D3)
5. Thermolyne Hotplate (Thermolyne)
6. Programmable Spin CoaterOther machines / facilities

Other machines / facilities

1. Wire bonding system (Kulicke & soffa 4500 Digital series)
2. Ultrasonic Cleaner (Brinson 1200)
3. Ozone cleaner (UVO cleaner 144AX-220)
4. Wafer scriber (Karl Suss)
5. General purpose oven
6. DI water system
7. Portable Liquid N2 tank
8. Chemical freezer
9. Wet station
10. Eye wash station
11. Fumehood / Wetbench