Sains Malaysiana 51(11)(2022): 3775-3784

http://doi.org/10.17576/jsm-2022-5111-21

Kesan Rawatan Termomekanik dengan Mampatan Tunggal terhadap Mikrostruktur dan Sifat Mikromekanik Aloi Pateri Sn-0.7Cu

(Effect of Thermomechanical Treatment with Single Compression on Microstructural and Micromechanical Properties of Sn-0.7Cu Solder Alloy)

FATEH AMERA MOHD YUSOFF¹, MARIA ABU BAKAR^1,* & AZMAN JALAR^1,2

¹Institut Kejuruteraan Mikro dan Nanoelektronik (IMEN), Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

²Jabatan Fizik Gunaan, Fakulti Sains dan Teknologi, Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

Received: 14 March 2022/ Accepted: 6 July 2022

Abstrak

Aloi pateri bebas plumbum telah digunakan secara meluas sebagai bahan antarasambungan bagi peranti elektronik yang memberikan sambungan elektrik bagi kebolehfungsian dan sokongan mekanik bagi integriti struktur. Rawatan termomekanik merupakan proses metalurgi yang melibatkan gabungan rawatan terma dan pembebanan mekanik. Kajian ini bertujuan untuk mengkaji kesan rawatan termomekanik dengan mampatan tunggal ke atas perubahan mikrostruktur dan sifat mikromekanik aloi pateri Sn-0.7Cu. Aloi pateri Sn-0.7Cu berbentuk bar dipotong kepada lapan sampel berbentuk kiub dengan ukuran 6 mm (p) × 6 mm (l) × 10 mm (t). Empat sampel yang pertama menjalani rawatan haba pada suhu 30 ℃, 60 ℃, 90 ℃ dan 120 ℃ selama 20 minit, diikuti dengan proses mampatan tunggal sebanyak 20% dan pelindapan di dalam medium air. Empat sampel yang berikutnya hanya didedahkan pada rawatan haba sahaja, diikuti pelindapan di dalam medium air digunakan sebagai sampel kawalan. Cerapan mikrostruktur menunjukkan butiran yang kecil dan seragam aloi pateri Sn-0.7Cu terbentuk dengan rawatan termomekanik mampatan tunggal pada suhu 120 °C akibat daripada penghabluran semula butiran. Keputusan kekerasan bagi aloi pateri Sn-0.7Cu selepas rawatan termomekanik mampatan tunggal pada suhu 120 °C telah menunjukkan perubahan yang sedikit iaitu sebanyak 19% berbanding sampel rawatan haba sebanyak 64%. Keputusan modulus terkurang juga menunjukkan tren yang sama iaitu perubahan yang lebih rendah bagi sampel dengan rawatan termomekanik mampatan tunggal pada suhu 120 °C sebanyak 52% manakala sampel rawatan haba sebanyak 69%. Penemuan kajian ini menunjukkan bahawa kesan suhu dalam rawatan termomekanik mampatan tunggal berupaya untuk mengubah suai mikrostruktur dan memberikan kestabilan sifat mikromekanik aloi pateri Sn-0.7Cu berbanding dengan rawatan haba.

Kata kunci: Kekerasan; modulus terkurang; penghabluran semula butiran; rawatan termomekanik mampatan tunggal; Sn-0.7Cu; ujian pelekukan nano

Abstract

Lead-free solder alloys have been widely used as interconnection materials for electronic devices that provide electrical connections for functionality and mechanical support for structural integrity. Thermomechanical treatment is a metallurgical process that involves a combination of thermal treatment and mechanical loading. This study aimed to investigate the effect of thermomechanical treatment with single compression on the microstructural changes and micromechanical properties of the Sn-0.7Cu solder alloy. A bar-shaped Sn-0.7Cu solder alloy was cut up into eight samples cube-shaped with dimensions of 6 mm (l) × 6 mm (w) × 10 mm (h). The first four samples were subjected to heat treatment for 20 min at 30 °C, 60 °C, 90 °C, and 120 °C, followed by single compression of 20% and water medium. The next four samples were subjected to heat treatment only, followed by quenching in a water medium used as control samples. Microstructural observation shows that small and uniform grains of Sn-0.7Cu solder alloy was formed from thermomechanical treatment with single compression at 120 °C due to grain recrystallization. The hardness result for Sn-0.7Cu solder alloy after thermomechanical treatment with single compression at 120 °C has shown tiny changes of 19% as compared to heat-treated samples with 64%. Reduced modulus results also showed the same trend whereby the lesser changes for the thermomechanical treatment sample were about 52% while the heat-treated sample was about 69%. The findings of this study indicate that the temperature in thermomechanical treatment with single compression has been able to alter the microstructure and give stability to the micromechanical properties of Sn-0.7Cu as opposed to heat treatment.

Keywords: Grain recrystallization; hardness; nanoindentation test; reduced modulus; single compression thermomechanical treatment; Sn-0.7Cu

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^*Corresponding author; email: maria@ukm.edu.my