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Sains Malaysiana 38(3): 395-400(2009)
Temperature and Flux Effect on Contact Angles and Intermetallic
between Sn-8Zn-3Bi Lead-free Solder and Cu Substrate
(Kesan Suhu dan Fluks terhadap
Sudut Sentuhan dan Antaramuka di antara
Pateri Bebas Plumbum Sn-8Zn-3Bi
dan Substrat Cu)
Ramani Mayappam* University Technology Mara, 02600-Arau, Zainal Arifin Ahmad School of Materials and Minerals Resources Engineering Engineering Campus, Universiti Sains Malaysia 14300 Nibong Tebal,
Abstract
The
influences of temperatures and fluxes on contact angles, intermetallic phase
and thickness of Sn-40Pb and Sn-8Zn-3Bi solders on copper substrate were
investigated. As expected, the contact angle decreases and the intermetallic
thickness increases as the temperature increases. The Sn-40Pb solder exhibits a
lower contact angles compared to Sn-8Zn-3Bi solder for all the fluxes tested. The
Sn-40Pb/Cu system exhibits a single Cu6Sn5 intermetallic.
The Sn-8Zn-3Bi/Cu interface exhibits ε(Cu-Zn) and γ-Cu5Zn8 phases and soldering at 280oC exhibits a single g-Cu5Zn8 phase. Sn-40Pb/Cu gives higher
intermetallic thickness compare to Sn-8Zn-3Bi/Cu system when soldering was done
at 220oC. On the other hand, the IMC thickness formed by Sn-8Zn-3Bi/Cu
system is higher than Sn-40Pb/Cu system for all other temperatures. Although, the
fluxes have no significant influence on the thickness of
Keywords: Contact angle; flux; intermetallic; Pb-free solder; Sn-Zn-Bi
ABSTRAK
Kesan suhu dan fluks terhadap sudut sentuhan, fasa dan ketebalan antaramuka pateri Sn-40Pb dan Sn-8Zn-3Bi dengan substrat Cu telah dikaji. Seperti diduga, sudut sentuhan berkurangan dan ketebalan antaramuka bertambah bila suhu bertambah. Pateri Sn-40Pb mempamerkan sudut sentuhan yang kecil berbanding dengan pateri Sn-8Zn-3Bi untuk ke semua fluks yang dikaji. Sistem Sn-40Pb/Cu mempamerkan antaramuka Cu6Sn5 yang tunggal. Sistem Sn-8Zn-3Bi/Cu mempamerkan fasa-fasa ε(Cu-Zn) and γ-Cu5Zn8 dan memateri pada suhu 280oC menghasilkan menghasilkan fasa γ-Cu5Zn8 yang tunggal. Ketebalan antaramuka pada suhu 220oC untuk sistem Sn-40Pb/Cu adalah lebih besar daripada sistem Sn-8Zn-3Bi/Cu untuk suhu-suhu yang lain. Walaupun fluks tidak mempengaruhi ketebalan antaramuka, tetapi ZnCl2 memberi ketebalan yang kurang berbanding dengan fluks yang lain.
Kata kunci: Antaramuka; fluks; Pateri tanpa Pb; Sn-Zn-Bi; sudut sentuhan
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