Sains Malaysiana 47(5)(2018): 1005–1010
http://dx.doi.org/10.17576/jsm-2018-4705-16
Kesan Pigmen Pewarna terhadap Pertumbuhan Sebatian antara Logam Sambungan Pateri Sn-3.0Ag-0.5Cu
(Effect of Coloured Pigment on Intermetallic Compound Growth of
Sn-3.0Ag-0.5Cu Solder Joint)
AZMAN JALAR1,2, MARIA ABU BAKAR1*, ROSLINA ISMAIL1, NAJIB SAEDI IBRAHIM3 & MOHD ARIFFIN AMBAK3
1Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia
2School of Applied
Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, 43600 UKM Bangi,
Selangor Darul Ehsan, Malaysia
3Redring Solder (M) Sdn. Bhd., Lot 17486, Jalan Dua, Taman Selayang Baru, 68100 Batu Caves, Selangor Darul Ehsan, Malaysia
Diserahkan: 21 September 2017/Diterima: 30 Disember 2017
ABSTRAK
Pewarnaan pes pateri membuka
suatu ruang
kepada keperluan dalam teknologi untuk proses pengenalpastian,
penandaan, piawaian, pengujian dan penilaian
terhadap antarasambungan
pes pateri. Dua jenis pigmen
pewarna iaitu hijau
(G) dan bercahaya
dalam gelap (GD)
digunakan untuk mengkaji kesan pewarnaan sambungan pateri ke atas
kestabilan antarasambungan
pateri Sn-3.0Ag-0.5Cu (SAC 305).
Pes pateri tanpa
warna digunakan
sebagai sampel kawalan untuk membandingkan
keputusan kajian.
Uji kaji penuaan sesuhu
digunakan untuk
melihat perubahan pertumbuhan sebatian antara logam (IMC).
Pigmen pewarna
GD
dengan peratusan sebanyak 5% telah menunjukkan kestabilan pertumbuhan IMC dengan
perubahan pertumbuhan
yang paling rendah iaitu
sebanyak 5.6 μm bagi sambungan pateri yang berwarna berbanding dengan peratusan pigmen pewarna yang lebih tinggi dengan perubahan
pertumbuhan IMC sehingga
9 μm selepas
didedahkan kepada penuaan sesuhu pada 150°C selama 1000 jam.
Walau bagaimanapun, kestabilan pertumbuhan IMC
dengan penggunaan pes pateri berwarna adalah lebih rendah
berbanding dengan
pes pateri tidak berwarna.
Maka
penambahan pigmen pewarna hendaklah dipertimbangkan dengan mengambil kira kestabilan mikrostruktur dan pertumbuhan lapisan IMC supaya
tidak menjejaskan
kualiti dan kebolehharapan
sesuatu sambungan
pateri.
Kata kunci: Bahan pateri Sn-Ag-Cu; pateri berwarna; pertumbuhan sebatian antara logam; pigmen pewarna; sambungan pateri
ABSTRACT
The colouration of solder paste opens up a space for technology
requirements for the identification, marking, standardization, testing and
evaluation processes of the solder inconnection. Two
types of colour pigments, green (G) and glow in the
dark (GD) are used to study the effect of coloured solder on stability of solder joint Sn-3.0Ag-0.5Cu (SAC 305). Colourless solder paste is used as a control sample
to compare the results of the study. The isothermal aging test is used to
observe the growth of intermetallic compound (IMC). GD colour pigment with a percentage of 5%
has shown growth stability with the lowest changes of IMC growth,
5.6 μm for coloured solder joint as compared to other higher colour pigment percentage with higher changes of IMC growth
up to 9 μm after subjected to isothermal aging
at 150°C for 1000 h. However, IMC growth stability with the
use of coloured solder paste is lesser than the colourless solder paste. Therefore, the addition of colour pigments should be considered on the stability of
the microstructure and the growth of the IMC layer so that it will not
affect the solder joint quality and reliability.
Keywords: Colour pigment; coloured solder;
intermetallic compound growth; solder joint; solder material Sn-Ag-Cu
RUJUKAN
Bakar, M.A., Jalar, A., Daud, A.R., Ismail, R., Lah,
N.C.A. & Ibrahim, N.S. 2016. Nanoindentation approach on investigating micromechanical properties of joining from green
solder materials. Sains Malaysiana45(8): 1275-1279.
Bang, J., Yu, D.Y., Ko,
Y.H., Kim, M.S., Nishikawa, H. & Lee, C.W. 2017. Intermetallic compound
formation and mechanical property of Sn-Cu-xCr/Cu
lead-free solder joint. Journal of Alloys and Compounds 725: 992-1001.
Boschetti, C., Henderson, J., Evans, J. & Leonelli,
C. 2016. Mosaic tesserae from
Italy and the production of Mediterranean coloured glass (4rd century BCE-4th century CE). Part I: Chemical composition and
technology. Journal of Archaeological Science: Reports 7: 303-311.
Burke, J.E. & Turnbull, D. 1952. Recrystallization and grain growth. Progress
in Metal Physics 3: 220-292.
Choudhury, S.F. & Ladani, L. 2016. Local shear stress-strain response of Sn-3.5Ag/Cu solder joint
with high fraction of intermetallic compounds: Experimental analysis. Journal
of Alloys and Compounds 680: 665-676.
Frear, D.R. & Tu, K.N. 2001. Metallurgical factors. Dlm. Area Array Interconnection Handbook, disunting oleh Puttlitz, K.J. & Totta, P.A.
New York: Springer & Business Media. pp. 1108-1143.
Holgado, P.H., Holgado,
M.J., Román, M.S.S. & Rives, V. 2015. Ni–Fe mixed
oxides prepared by calcination of layered double hydroxides: Potential ts for the ceramic industry. Ceramics International 41(7):
8451-8460.
Hu, X., Xu, T., Jiang, X., Li, Y., Liu, Y. & Min, Z. 2016. Effect of post-reflow cooling rate and thermal
aging on growth behavior of interfacial intermetallic compound between SAC305
solder and Cu substrate. Appl. Phys. A 122: 278.
Humphreys, F.J. & Hatherly, M. 2004. Recrystallization and Related Annealing Phenomena.
Amsterdam: Elsevier.
Ismail, N., Ismail, R., Abd Aziz, N.I.
& Jalar, A. 2016. Wettability of CNT-doped solder under isothermal aging. Materials Science
Forum 857: 76-78.
Jiang, B.C., Wang, C.C. & Hsu, Y.N. 2007. Machine vision and background remover-based approach for PCB
solder joints inspection. International Journal of Production Research 45(2):
451-464.
Jovaní, M., Sanz, A., Beltrán-Mir,
H. & Cordoncillo, E. 2016. New red-shade environmental-friendly multifunctional t based on
Tb and Fe doped Y2Zr2O7
for ceramic applications and cool roof coatings. Dyes and Pigments 133:
33-40.
Kim, H.K. & Kim, S.H. 2016. Optical properties of pre-colored dental monolithic zirconia
ceramics. Journal of Dentistry 55: 75-81.
Kim, J.H. 2000. Method and
Apparatus for Inspecting Solder Joints. Patent Number: 6,111,602.
Kim, J.H. & Cho, H.S. 1995. Neural network-based inspection of solder joints using a circular illumination. Image and Vision Computing 13(6): 479-490.
King, C.E. & Gulino, A.J. 1998. Preformed Solder Parts Coated with Parylene in a Thickness Effective to Exhibit Predetermined Interference Colors.
Patent Number: 5,789,068.
Li, Z.L., Li, G.Y., Li, B., Cheng, L.X., Huang, J.H. & Tang,
Y. 2016. Size effect on IMC growth in
micro-scale Sn-3.0Ag- 0.5Cu-0.1TiO2 solder joints in reflow
process. Journal of Alloys and Compounds 685: 983-991.
Lin, Y.C., Shih, T.Y., Tien, S.K. & Duh, J.G. 2007. Suppressing Ni–Sn–P growth in SnAgCu/Ni–P solder joints. Scripta Materialia56: 49-52.
Mantovani, L., Tribaudino, M., Dondi, M. & Zanelli, C. 2015. Synthesis and color performance of CaCoSi2O6
pyroxene, a new ceramic colorant. Dyes and Pigments 120: 118-125.
Mayappan, R., Hassan, A.A., Ghani, N.A.A., Yahya,
I. & Andas, J. 2016. Improvement in intermetallic thickness and
joint strength in carbon nanotube composite Sn-3.5Ag lead-free solder. Materials
Today: Proceedings 3: 1338-1344.
Möncke, D., Papageorgiou, M., Winterstein-Beckmann, A. & Zacharias, N. 2014. Roman glasses coloured by dissolved
transition metal ions: Redox-reactions, optical spectroscopy and ligand field
theory. Journal of Archaeological Science 46: 23-36.
Nor, N.A.M., Aziz, N., Adnan, A.F.M., Taha,
R.M. & Arof, A.K. 2016. Chromaticity and color
saturation of ultraviolet irradiated poly (vinyl alcohol)-anthocyanin coatings. Optical Materials 56: 18-21.
Ren, G., Wilding, I.J. & Collins, M.N. 2016. Alloying influences on low melt temperature SnZn and SnBi solder alloys for electronic
interconnections. Journal of Alloys and Compounds 665: 251-260.
Skowroński, Ł., Trzcinski, M., Antończak, A.J., Domanowski,
P., Kustra, M., Wachowiak,
W., Naparty, M.K., Hiller, T., Bukaluk,
A. & Wronkowska, A.A. 2014. Characterisation of coloured TiOx/Ti/glass systems. Applied
Surface Science 322: 209-214.
Thieme,
C., Waurischk, T., Lin, C. & Rüssel,
C. 2016. Lilac ceramic ts based on
Ba0.5Sr0.5Zn2−xNixSi2O7 solid solutions. Ceramics International 42(11):
13035-13040.
Yahaya,
M.Z., Ani, F.C., Samsudin, Z., Abdullah, M.Z. &
Mohamad, A.A. 2016. Hardness profiles on Sn-3.0Ag- 0.5Cu-TiO2 composited solder by nanoindentation. Materials Science and Engineering A669: 178-186.
Zeng,
Z., Ma, L. & Suwa, M. 2011. Algorithm of locating
PCB components based on colour distribution of solder
joints. Int. J. Adv. Manuf. Technol. 53: 601-614.
Zhang,
L., Liu, Z.Q., Yang, F. & Zhong, S.J. 2017. Cu6Sn5 whiskers
precipitated in Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar
cells solder layer. Materials 10(4): 327.
*Pengarang untuk surat-menyurat; email: maria@.ukm.edu.my