Items

Details

Description

A small-scale crystalline silicon ingot wire saw designed to slice thin wafers. This wire saw application would be for R&D as well as manufacturing. The primary function of this tool would be to lower wafer cost by slicing as many wafers as possible from a staring ingot at the lowest possible cost. Wire saw will handle both round (6”-8” diameter) and square (up to 6”x6”) single and multi-crystalline ingots. Wire saw design mechanically and thermally stable with easy setup and maintenance.

Cross-Section Ingot

Ø 220 mm

Number of Ingots

 1 × 820 mm / 2 × 410 mm

Maximum Ingot Length

820 mm

Minimum Wafer Thickness

0.1mm

Cutting Wire Diameter

0.1 to 0.16 mm

Cutting Maximum Speed:

15 m/s

Cutting Direction

Forward or reverse cutting

PIC

Mohamad Arif bin Mokhtar

(03-89217162/ arifseri@ukm.edu.my)

Charge

RFP/Rent (Please Contact PIC)

Items

Details

Description

A small, laboratory scale, single crystal silicon ingot grower based on CZ pulling method with capability to grow n and p-doped ingots with diameter in 6”-8” range.

Ingot Length

~ 3-6 feet

Ingot Diameter

6-8 inch diameter

Ingot Mass Range

30–120 Kg

Orientation

100

Bulk Resistivity

0.5-3 ohm-cm range

Operation

Real–time, pc–based control system during growth

PIC

Mohamad Arif bin Mokhtar

(03-89217162/ arifseri@ukm.edu.my)

Charge

RFP/Rent (Please Contact PIC)