Sains Malaysiana 46(2)(2017): 295–302

http://dx.doi.org/10.17576/jsm-2017-4602-14

 

Electrochemical Corrosion Behaviour of Pb-free SAC 105 and SAC 305 Solder Alloys: A Comparative Study

(Perilaku Kakisan Elektrokimia Aloi Pateri Pb-free SAC 105 dan SAC 305: Suatu Kajian Perbandingan)

 

M. FAYEKA, A.S.M.A. HASEEB & M.A. FAZAL*

 

Department of Mechanical Engineering, University of Malaya, 50603 Kuala Lumpur, Federal Territory, Malaysia

 

Received: 17 September 2015/Accepted: 24 May 2016

 

ABSTRACT

Sn-Ag based solder alloy seems to be a promising lead-free solder for the application on electronic assembly. The corrosion behavior of different lead free solder alloys such as Sn-3.0Ag, Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu was investigated in 3.5% NaCl solution by potentiodynamic polarization and electrochemical impedance spectroscopy. Scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX) and X-ray diffraction (XRD) were used to characterize the samples after the tests. The results showed that the addition of 0.5 wt. % copper with Sn-3.0 Ag solder alloy led to a better corrosion resistance while lowering of Ag content from 3.0 to 1.0 wt. % decreased the resistance. Sn-3.0Ag-0.5Cu exhibits a better corrosion resistance in terms of increased charge transfer resistance and impedance values as well as the lowest capacitance. These characteristics signify its suitability for the application in electronic packaging.

 

Keywords: Corrosion; EIS; Pb-free solders; potentiodynamic polarization

 

ABSTRAK

Aloi pateri berasaskan Sn-Ag berpotensi menjadi pateri bebas-Pb untuk diaplikasikan sebagai pemasangan elektronik. Tindak balas kakisan aloi pateri bebas Pb yang berbeza seperti Sn-3.0Ag, Sn-1.0Ag-0.5Cu dan Sn-3.0Ag-0.5Cu dikaji dalam larutan 3.5% NaCl menggunakan upaya dinamik pengutuban dan spektroskopi impedans elektrokimia. Mikroskop imbasan elektron (SEM), spektroskopi sinar-X tenaga terserak (EDX) dan pembelauan sinar-X (XRD) telah digunakan untuk mencirikan sampel selepas ujian. Hasil kajian menunjukkan bahawa penambahan 0.5 %. bt tembaga ke dalam aloi pateri Sn-3.0Ag menghasilkan rintangan kakisan yang lebih baik. Manakala mengurangkan kandungan Ag daripada 3.0 kepada 1.0 %. bt, menurunkan rintangan. Sn-3.0Ag-0.5Cu menunjukkan kakisan yang lebih baik daripada segi peningkatan pemindahan cas rintangan dan nilai impedansi. Ia juga mempunyai kapasitans yang paling rendah. Ciri-ciri ini mencerminkan kesesuaian bahan ini dalam aplikasi pembungkusan elektronik.

 

Kata kunci: EIS; kakisan; pateri bebas Pb; upaya dinamik pengutuban

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*Pengarang untuk surat-menyurat; email: fazal@um.edu.my