Sains Malaysiana 51(11)(2022): 3775-3784

http://doi.org/10.17576/jsm-2022-5111-21

 

Kesan Rawatan Termomekanik dengan Mampatan Tunggal terhadap Mikrostruktur dan Sifat Mikromekanik Aloi Pateri Sn-0.7Cu

(Effect of Thermomechanical Treatment with Single Compression on Microstructural and Micromechanical Properties of Sn-0.7Cu Solder Alloy)

 

FATEH AMERA MOHD YUSOFF¹, MARIA ABU BAKAR^1,* & AZMAN JALAR^1,2

 

¹Institut Kejuruteraan Mikro dan Nanoelektronik (IMEN), Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

²Jabatan Fizik Gunaan, Fakulti Sains dan Teknologi, Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

 

Diserahkan: 14 Mac 2022/Diterima: 6 Julai 2022

 

Abstrak

Aloi pateri bebas plumbum telah digunakan secara meluas sebagai bahan antarasambungan bagi peranti elektronik yang memberikan sambungan elektrik bagi kebolehfungsian dan sokongan mekanik bagi integriti struktur. Rawatan termomekanik merupakan proses metalurgi yang melibatkan gabungan rawatan terma dan pembebanan mekanik. Kajian ini bertujuan untuk mengkaji kesan rawatan termomekanik dengan mampatan tunggal ke atas perubahan mikrostruktur dan sifat mikromekanik aloi pateri Sn-0.7Cu. Aloi pateri Sn-0.7Cu berbentuk bar dipotong kepada lapan sampel berbentuk kiub dengan ukuran 6 mm (p) × 6 mm (l) × 10 mm (t). Empat sampel yang pertama menjalani rawatan haba pada suhu 30 ℃, 60 ℃, 90 ℃ dan 120 ℃ selama 20 minit, diikuti dengan proses mampatan tunggal sebanyak 20% dan pelindapan di dalam medium air. Empat sampel yang berikutnya hanya didedahkan pada rawatan haba sahaja, diikuti pelindapan di dalam medium air digunakan sebagai sampel kawalan. Cerapan mikrostruktur menunjukkan butiran yang kecil dan seragam aloi pateri Sn-0.7Cu terbentuk dengan rawatan termomekanik mampatan tunggal pada suhu 120 °C akibat daripada penghabluran semula butiran. Keputusan kekerasan bagi aloi pateri Sn-0.7Cu selepas rawatan termomekanik mampatan tunggal pada suhu 120 °C telah menunjukkan perubahan yang sedikit iaitu sebanyak 19% berbanding sampel rawatan haba sebanyak 64%. Keputusan modulus terkurang juga menunjukkan tren yang sama iaitu perubahan yang lebih rendah bagi sampel dengan rawatan termomekanik mampatan tunggal pada suhu 120 °C sebanyak 52% manakala sampel rawatan haba sebanyak 69%. Penemuan kajian ini menunjukkan bahawa kesan suhu dalam rawatan termomekanik mampatan tunggal berupaya untuk mengubah suai mikrostruktur dan memberikan kestabilan sifat mikromekanik aloi pateri Sn-0.7Cu berbanding dengan rawatan haba.

 

Kata kunci: Kekerasan; modulus terkurang; penghabluran semula butiran; rawatan termomekanik mampatan tunggal; Sn-0.7Cu; ujian pelekukan nano

 

Abstract

Lead-free solder alloys have been widely used as interconnection materials for electronic devices that provide electrical connections for functionality and mechanical support for structural integrity. Thermomechanical treatment is a metallurgical process that involves a combination of thermal treatment and mechanical loading. This study aimed to investigate the effect of thermomechanical treatment with single compression on the microstructural changes and micromechanical properties of the Sn-0.7Cu solder alloy. A bar-shaped Sn-0.7Cu solder alloy was cut up into eight samples cube-shaped with dimensions of 6 mm (l) × 6 mm (w) × 10 mm (h). The first four samples were subjected to heat treatment for 20 min at 30 °C, 60 °C, 90 °C, and 120 °C, followed by single compression of 20% and water medium. The next four samples were subjected to heat treatment only, followed by quenching in a water medium used as control samples. Microstructural observation shows that small and uniform grains of Sn-0.7Cu solder alloy was formed from thermomechanical treatment with single compression at 120 °C due to grain recrystallization. The hardness result for Sn-0.7Cu solder alloy after thermomechanical treatment with single compression at 120 °C has shown tiny changes of 19% as compared to heat-treated samples with 64%. Reduced modulus results also showed the same trend whereby the lesser changes for the thermomechanical treatment sample were about 52% while the heat-treated sample was about 69%. The findings of this study indicate that the temperature in thermomechanical treatment with single compression has been able to alter the microstructure and give stability to the micromechanical properties of Sn-0.7Cu as opposed to heat treatment.

 

Keywords: Grain recrystallization; hardness; nanoindentation test; reduced modulus; single compression thermomechanical treatment; Sn-0.7Cu

 

RUJUKAN

Aamir, M., Muhammad, R., Tolouei-Rad, M., Giasin, K. & Silberschmidt, V.V. 2019. A review: Microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics. Soldering & Surface Mount Technology 32(2): 115-126.

Abdullah, I., Zulkifli, M.N., Jalar, A. & Ismail, R. 2018. Deformation behavior relationship between tensile and nanoindentation tests of SAC305 lead-free solder wire. Soldering and Surface Mount Technology 30(3): 194-202.

Bakar, M.A., Jalar, A., Wan Yusoff, W.Y., Safee, N.S., Ismail, A., Ismail, N., Salleh, E.M. & Ibrahim, N.S. 2019. Effect of shock wave on micromechanical properties of SAC 0307/ENiG solder joint using nanoindentation approach. Sains Malaysiana 48(6): 1273-1279.

Baghdadi, A.H., Rajabi, A., Selamat, N.F.M., Sajuri, Z. & Omar, M.Z. 2019. Effect of post-weld heat treatment on the mechanical behavior and dislocation density of friction stir welded Al6061. Materials Science and Engineering: A 754: 728-734.

Barkov, R.Y., Mikhaylovskaya, A.V., Yakovtseva, O.A., Loginova, I.S., Prosviryakov, A.S. & Pozdniakov, A.V. 2021. Effects of thermomechanical treatment on the microstructure, precipitation strengthening, internal friction, and thermal stability of Al–Er-Yb-Sc alloys with good electrical conductivity. Journal of Alloys and Compounds 855: 157367.

Depiver, J.A., Mallik, S. & Harmanto, D. 2021. Solder joint failures under thermo-mechanical loading conditions - A review. Advances in Materials and Processing Technologies 7(1): 1-26.

Fazal, M.A., Liyana, N.K., Rubaiee, S. & Anas, A. 2019. A critical review on performance, microstructure and corrosion resistance of Pb-free solders. Measurement: Journal of the International Measurement Confederation 134: 897-907.

He, H., Yi, Y., Huang, S., Guo, W. & Zhang, Y. 2020. Effects of thermomechanical treatment on grain refinement, second-phase particle dissolution, and mechanical properties of 2219 Al alloy. Journal of Materials Processing Technology 278: 116506.

Hu, X., Chai, L., Shen, J., Wu, H., Li, Y., Cheng, J., Luo, J. & Yao, L. 2022. Microstructure, texture, and hardness evolution of cold-rolled high-purity Ti sheet during annealing at 350 °C to 550 °C. Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science 53(6): 2086-2098.

Huang, C.M., Raj, A., Osterman, M. & Pecht, M. 2020. Assembly options and challenges for electronic products with lead-free exemption. IEEE Access 8: 134194-134208.

Ismail, N., Jalar, A., Abu Bakar, M., Ismail, R., Safee, N.S., Ismail, A.G. & Ibrahim, N.S. 2019. Effect of isothermal aging on microhardness properties of Sn-Ag-Cu/CNT/Cu using nanoindentation. Sains Malaysiana 48(6): 1267-1272.

Ismail, N., Jalar, A., Bakar, M.A. & Ismail, R. 2018. Effect of carbon nanotube addition on the growth of intermetallic layer of Sn-Ag-Cu solder system under thermal aging. Sains Malaysiana 47(7): 1585-1590.

Jalar, A., Bakar, M.A. & Ismail, R. 2020. Temperature dependence of elastic–plastic properties of fine-pitch SAC 0307 solder joint using nanoindentation approach. Metallurgical and Materials Transactions A 51(3): 1221-1228.

Jeong, M.S., Lee, D.H. & Yoon, J.W. 2022. Effect of temperature on shear properties of Sn-3.0Ag-0.5Cu and Sn-58Bi solder joints. Journal of Alloys and Compounds 903: 163987.

Joo, H.S., Hwang, S.K. & Im, Y.T. 2018. Effect of thermomechanical treatment on mechanical and electrical properties of Cu-Cr-Zr alloy in continuous hybrid process. Procedia Manufacturing 15: 1525-1532.

Kudryashova, A., Sheremetyev, V., Lukashevich, K., Cheverikin, V., Inaekyan, K., Galkin, S., Prokoshkin, S. & Brailovski, V. 2020. Effect of a combined thermomechanical treatment on the microstructure, texture and superelastic properties of Ti-18Zr-14Nb alloy for orthopedic implants. Journal of Alloys and Compounds 843: 156066.

Le, W.K., Ning, X., Ke, C.B., Zhou, M.B. & Zhang, X.P. 2019. Current density dependent shear performance and fracture behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads. Journal of Materials Science: Materials in Electronics 30(16): 15184-15197.

Lee, A., Zee, B. & Foo, F.J. 2021. Application of EBSD study of Cu-Sn IMCs in SAC305 and Sn0.7Cu solder joints to determine the suitability of Sn0.7Cu solder as alternative in mitigating ILD cracks/delamination. 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). pp. 435-439.

Liu, G. & Ji, S. 2019. Microstructure, dynamic restoration and recrystallization texture of Sn-Cu after rolling at room temperature. Materials Characterization 150(December 2018): 174-183.

Lodo, K., Dalgleish, C., Patel, M. & Veitch, M. 2018. A novel public health threat - high lead solder in stainless steel rainwater tanks in Tasmania. Australian and New Zealand Journal of Public Health 42(1): 77-82.

Mondol, S., Kumar, S. & Chattopadhyay, K. 2019. Effect of thermo-mechanical treatment on microstructure and tensile properties of 2219ScMg alloy. Materials Science and Engineering: A 759: 583-593.

Morando, C. & Fornaro, O. 2021. Influence of aging on microstructure and hardness of lead-free solder alloys. Soldering and Surface Mount Technology 33(1): 57-64.

Nabihah, A. & Nurulakmal, M. 2019. Effect of In addition on microstructure, wettability and strength of SnCu solder. Materials Today: Proceedings 17: 803-809.

Qin, H.B., Zhang, X.P., Zhou, M.B., Li, X.P. & Mai, Y.W. 2015. Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints. Microelectronics Reliability 55(8): 1214-1225.

Raj, R., Shrivastava, P., Jindal, N., Alam, S.N., Naithani, N., Padhy, M., Phani, A.S.D., Ramana, T.V.V. & Abbas, M.M. 2019. Development and characterization of eutectic Sn-Zn, Sn-Ag, Sn-Bi and Sn-Cu solder alloys. International Journal of Materials Research 110 (12): 1150-1159.

Rollett, A., Rohrer, G.S. & Humphreys, J. 2017. Recrystallization and Related Annealing Phenomena. 3rd ed. Oxford: Elsevier.

Román-Ochoa, Y., Choque Delgado, G.T., Tejada, T.R., Yucra, H.R., Durand, A.E. & Hamaker, B.R. 2021. Heavy metal contamination and health risk assessment in grains and grain-based processed food in Arequipa region of Peru. Chemosphere 2021: 129792.

Sonawane, P.D., Bupesh Raja, V.K. & Gupta, M. 2021. Mechanical properties and corrosion analysis of lead-free Sn-0.7Cu solder CSI joints on Cu substrate. Materials Today: Proceedings 46: 1101-1105.

Sonawwanay, P.D. & Raja, V.K.B. 2019. Advances in lead-free solders. International Journal of Mechanical Engineering and Technology (IJMET) 10(2): 520-526.

Sun, Y., Chen, P., Liu, L., Yan, M., Wu, X., Yu, C. & Liu, Z. 2018. Local mechanical properties of Al CoCrCuFeNi high entropy alloy characterized using nanoindentation. Intermetallics 93: 85-88.

Tang, Z., Jiang, F., Long, M., Jiang, J., Liu, H. & Tong, M. 2020. Effect of annealing temperature on microstructure, mechanical properties and corrosion behavior of Al-Mg-Mn-Sc-Zr alloy. Applied Surface Science 514: 146081.

Xu, R., Liu, Y. & Sun, F. 2019. Effect of isothermal aging on the microstructure, shear behavior and hardness of the Sn58Bi/Sn3.0Ag0.5Cu/Cu solder joints. Results in Physics 15: 102701.

Zeng, H., Sui, H., Wu, S., Liu, J., Wang, H., Zhang, J. & Yang, B. 2021. Evolution of the microstructure and properties of a Cu–Cr-(Mg) alloy upon thermomechanical treatment. Journal of Alloys and Compounds 857: 157582.

Zhong, S.J., Zhang, L., Li, M.L., Long, W.M. & Wang, F.J. 2022. Development of lead-free interconnection materials in electronic industry during the past decades: Structure and properties. Materials and Design 215: 110439.

 

^*Pengarang untuk surat-menyurat; email: maria@ukm.edu.my