The Malaysian Journal of Analytical Sciences Vol 11 No 1 (2007): 213 – 218

 

 

FORMULATION OF LIGNIN PHENOL FORMALDEHYDE RESINS AS A WOOD ADHESIVE

 

M.N Mohamad Ibrahim, A. Md. Ghani and N. Nen

 

School of Chemical Sciences, Universiti Sains Malaysia,

11800 Minden, Pulau Pinang, Malaysia

 

Abstract

This work describes the potential of reducing phenol with lignin in phenol formaldehyde resin formulation. The physical and chemical properties between lignin  phenol formaldehyde resin (LPF) and commercial phenol  formaldehyde resin (CPF) were compared. Phenol had been replaced by lignin [that was extracted from black liquor of oil palm empty fruit bunch (EFB)] in synthesizing resin with a ratio lignin to phenol  1:1.  The IR  spectra showed that there were similarities in functional groups between LPF resin and CPF resin. The comparison of physical strength properties via tensile strength test between LPF resin and CPF resin  showed that the newly formulated resin has higher bonding strength compared to commercial resin. Kinematics viscosity test showed that LPF resin has lower kinematics viscosity compared to CPF resin in 21 days storage time. SEM images for both resin showed similarities in the effect of resin penet ration into wood’s vessel existed.

 

Keywords: lignin phenol formaldehyde res in, phenol formaldehyde resin, lignin, black liquor, oil palm empty fruit bunch (EFB)

 

References

1.         Roger M. R., 1994. Kimia Kayu Padu, Edisi Kedua terjemahan Suhaimi Muhammed dan Halimahton Haji Mansor, Percetakan Dewan Bahasa dan Pustaka.

2.         Website 1: www.wikipedia.org/wiki phenol formaldehyde resin (accessed on 23/6/2005)

3          Mohamad Ibrahim M. N., Chuah S. B. and Wan Rosli W. D., 2004, Characterization of Lignin Precipitated from the Soda Black Liquor of Oil Palm Empty Fruit Bunch Fibers by Various Mineral Acids, AJTSD Vol.21 Issue 1 : 57-61

4          Muzaffar A. K, Sayed M. A and Ved P. M , 2004. Development and Characterization of Wood Adhesive using Bagasse Lignin, International Journal of Adhesion & Adhesives, 24 : 485-493.

5          Poljansek I. and Kranjc M,  2005. Characterization of Phenol-Formaldehyde  Prepolymer  Resin  by  In  Line FT-IR Spectroscopy, Acta Chim, 52 : 238-244.

6          Bruice, P. Y. , 2004. Organic Chemistry 4th Edition, Pearson Education International, New Jersey .

7          Nihat  S.  C  and  Nilgul  O,  2002.  Use  of  Organosolv  Lignin  in  Phenol-Formaldehyde  Resin  for  Particleboard Production, International Journal of Adhesion & Adhesives, 22 : 477-480.

8          Gindl W., Schoberl T. dan Jeronimidis G., 2004. The interphase in Phenol-Formaldehyde and  Polymeric Methylene Di-Phenyl-Di-Isocyanate Glue Line in Wood, International Journal of Adhesion & Adhesive, 24 : 487-495.

9          Tsoumis G. T, Science and Technology of Wood: Structure, Properties and Utilization, von Nostrand Reinhold, New York, 36-37 (1991)

10       Robert L., 1995. Polymer Chemistry, Revised Edition-A Teaching Package for Pre-Collage Teachers, National Science Teachers Association, Wilson Boulevard, 145-156.

11       Terry S. Jr., 1985. Plywood and Adhesive Technology, Marcel deckker Inc., New York, 132-140.

12       Shawkataly A. K. and Rokiah. H, 2004. Komposit Panel Berasaskan Sumber Kayu, Penerbit Universiti Sains Malaysia, Pulau Pinang, 232-237.